摘要
针对铜氧化物和镍氧化物中高温超导的配对机制这一长期难题,本文基于离子键在eV量级的主导作用、O-和O2-的电子亲和能(分别为1.46 eV和-8.08 eV)以及金属原子较大的双电子电离能(约15–28 eV),提出了氧(O)桥连电子对(e--O-e-)或金属(M)桥连空穴对(h+-M-h+)的巡游库珀对图像。该配对在赝隙温度T*高于Tc时形成,遵循化学键→结构→性质的关系,并适用于铜氧化物、镍氧化物、铁基及其他离子型超导体。作者通过32项不同的实验证据,尤其是CuO2面内的STM图像与极小配对尺寸,证实了该机制的正确性与普适性,并指出任何亚eV或共价键合配对机制均不可靠。该理论揭示了离子键与超导电性之间的缺失环节,解决了长达40年的困惑,并验证了在离子键超导体中实现室温载流子配对的可行性。在此基础上,作者建立了以最强配对强度和玻色-爱因斯坦凝聚为核心的新理论框架,为理解高温超导机理开辟了新路径,并使室温超导的梦想更近一步。
材料
- YBa2Cu3O7
- Bi2Sr2CaCu2O8
- La3Ni2O7
- La2PrNi2O7
方法
- theoretical analysis based on ionic bonding
- charge sum rule
- comparison with STM images
- calculation of screened Coulomb repulsion
关键词
- ionic bond
- cooper pair
- oxygen bridged pairing
- metal bridged pairing
- pseudogap
- bose einstein condensation
- d wave symmetry
- charge stripe
- room temperature superconductivity
亮点
- This mechanism is applicable to cuprates, nickelates, iron-based and other new ionic superconductors.
- The STM image in the CuO2 plane combining with the small pair size serves as an ironclad proof.
- Any other sub-eV and covalent-binding pairing mechanisms would be doubtful.
- The theory reveals that room-temperature Cooper pairing is feasible in ionic-bonded superconductors.
结论
- We propose an innovative idea of electron e- (hole h+) pairing bridged by oxygen O (metal M) atoms, i.e., the ionic-bond-driven e- -O- e- (h+ -M- h+) itinerant Cooper pairing.
- Its correctness and universality are confirmed by 32 diverse experimental evidences.
- Our findings provide the missing link between ionic bonding and superconductivity, resolve a 40-year puzzle and validate the feasibility of room-temperature carrier-pairing in ionic superconductors.
主要论断
- Ionic-bond-driven oxygen-bridged electron pairs (e--O-e-) and metal-bridged hole pairs (h+-M-h+) are the universal Cooper pairing mechanism in cuprates, nickelates, and other ionic superconductors.
- 证据: abstract: 'we propose a groundbreaking idea of electron e- (hole h+) pairing bridged by oxygen O (metal M) atoms',full_text: 'the ionic-bond-driven e--O-e- (h+-M-h+) itinerant Cooper pairing formed at pseudogap temperature T* > Tc'
- The proposed pairing mechanism is supported by 32 diverse experimental evidences, especially STM images of hole stripes along Cu-O-Cu chains and small Cooper pair size.
- 证据: abstract: 'correctness and universality are confirmed by 32 diverse experimental evidences, especially, the STM image in the CuO2 plane combining with the small Cooper-pair size',full_text Fig. 4a shows STM constant-current topographic image of hole stripe phase
- Any sub-eV pairing mechanism (e.g., magnetic or electron-phonon) cannot overcome the eV-scale Coulomb repulsion between two holes in a Cooper pair; eV-scale ionic bonds are required.
- 证据: full_text Fig. 3 shows calculated screened Coulomb repulsion ≈2.63 eV for two holes at 1.5 Å,abstract: 'Any other sub-eV and covalent-binding pairing mechanisms would be doubtful'
- The eV-scale ionic bonding enables Cooper pair formation above Tc or even at room temperature, potentially enabling room-temperature superconductivity if coherent condensation is achieved.
- 证据: full_text: 'the eV-scale ionic bonds… ensure that Cooper pairs can be formed above Tc or even at room temperature',abstract: 'validate the feasibility of room-temperature carrier-pairing in ionic-bonded superconductors'
研究流程
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